Änderungen
Aus Hackerspace Ffm
by: [[Benutzer:DCEM|DCEM]]
Polygon:
use Rank to draw polygons into each ohter
Thermal Pads:
Use thermal symbol connected to GND request level swap
use one SMD Pad (TP0) for the surface area
use as much Pads (TP1 - TPX) as needed for heat transfer
qfn packages (or othes small pitch packages) :
use smd pads with roundness 100% (round edges are better for solder paste release)
Additional Information regarding PCB-Design.
This is a work in progress and will hopefully be updated.
by: [[Benutzer:DCEM|DCEM]]
Description:
<nowiki><h1>PART_NAME</h1>
SHORT_DESCRIPTION
<h2>Links</h2>
<ul>
<li>
<a href="HTTPS_LINK">Datasheet</a><br>
</li>
<li>
<a href="HTTPS_LINK">Product website</a><br>
</li>
</ul></nowiki>
Keepout
OC_MOUSER
== Silk Screen ==
PCB-Pool:
(t/b)Place and (t/b)Names will be printed
minimum font size:
0,6mm (acceptable readability) - 0,8mm(good readability) keywords: land pattern, footprint
[[Kategorie:Projekte]]
