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PCB-Design: Eagle Library

202 Byte hinzugefügt, 10:01, 31. Mai 2018
by: [[Benutzer:DCEM|DCEM]]
 
Prefix:
[https://en.wikipedia.org/wiki/Reference_designator Wikipedia: Reference designator]
 
Polygon:
use Rank to draw polygons into each ohter
 
Thermal Pads:
Use thermal symbol connected to GND request level swap
use one SMD Pad (TP0) for the surface area
use as much Pads (TP1 - TPX) as needed for heat transfer
 
qfn packages (or othes small pitch packages) :
use smd pads with roundness 100% (round edges are better for solder paste release)
 
 
Additional Information regarding PCB-Design.
This is a work in progress and will hopefully be updated.
Description:
 <code>  <nowiki><code><h1>PART_NAME</h1>
SHORT_DESCRIPTION
<h2>Links</h2>
<a href="HTTPS_LINK">Product website</a><br>
</li>
</ul></codenowiki></nowiki>
<code>
<<nowiki/>h2>Links</h2>
<<nowiki/>ul>
<<nowiki/>li>
<<nowiki/>a href="HTTPS_LINK">Datasheet<<nowiki/>/a><<nowiki/>br>
<<nowiki/>/li>
<<nowiki/>li>
<<nowiki/>a href="HTTPS_LINK">Product website<<nowiki/>/a><<nowiki/>br>
<<nowiki/>/li>
<<nowiki/>/ul>
</code>
minimum font size:
0,6mm (acceptable readability) - 0,8mm (good readability)
 
 
keywords:
land pattern, footprint
[[Kategorie:Projekte]]
610
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