Additional Information regarding PCB-Design.
This is a work in progress and will hopefully be updated.
by: [[Benutzer:DCEM|DCEM]]
DescriptionPrefix:[https://en.wikipedia.org/wiki/Reference_designator Wikipedia: Reference designator]
<<nowiki/>h1>PART_NAME<<nowiki/>/h1>Polygon:use Rank to draw polygons into each ohter
SHORT_DESCRIPTIONThermal Pads:Use thermal symbol connected to GND request level swapuse one SMD Pad (TP0) for the surface areause as much Pads (TP1 - TPX) as needed for heat transfer
<<nowiki/>h2>Links<<nowiki/>/h2>qfn packages (or othes small pitch packages) :use smd pads with roundness 100% (round edges are better for solder paste release)
<<nowiki/>ul>
Additional Information regarding PCB-Design.This is a work in progress and will hopefully be updated.by: [[Benutzer:DCEM|DCEM]] Description: <nowiki><h1>PART_NAME<nowiki/h1>liSHORT_DESCRIPTION<h2>Links</h2><ul> <li> <<nowiki/>a href="HTTPS_LINK">Datasheet<<nowiki/>/a><<nowiki/>br> <<nowiki/>/li> <<nowiki/>li> <<nowiki/>a href="HTTPS_LINK">Product website<<nowiki/>/a><<nowiki/>br> <<nowiki/>/li> <<nowiki/ul></ulnowiki>
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minimum font size:
0,6mm (acceptable readability) - 0,8mm (good readability)
keywords:
land pattern, footprint
[[Kategorie:Projekte]]
