PCB-Design: Eagle Library

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Version vom 31. Mai 2018, 12:01 Uhr von DCEM (Diskussion | Beiträge)

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by: DCEM

Prefix: Wikipedia: Reference designator

Polygon: use Rank to draw polygons into each ohter

Thermal Pads: Use thermal symbol connected to GND request level swap use one SMD Pad (TP0) for the surface area use as much Pads (TP1 - TPX) as needed for heat transfer

qfn packages (or othes small pitch packages) : use smd pads with roundness 100% (round edges are better for solder paste release)


Additional Information regarding PCB-Design. This is a work in progress and will hopefully be updated. by: DCEM

Description:

<h1>PART_NAME</h1>
SHORT_DESCRIPTION
<h2>Links</h2>
<ul>
   <li>
      <a href="HTTPS_LINK">Datasheet</a><br>
   </li>
   <li>
      <a href="HTTPS_LINK">Product website</a><br>
   </li>
</ul>




Keepout

OC_MOUSER

Silk Screen

PCB-Pool: (t/b)Place and (t/b)Names will be printed

minimum font size: 0,6mm (acceptable readability) - 0,8mm (good readability)


keywords: land pattern, footprint