Änderungen
Aus Hackerspace Ffm
by: [[Benutzer:DCEM|DCEM]]
Thermal Pads:
Use thermal symbol connected to GND request level swap
use one SMD Pad (TP0) for the surface area
use as much Pads (TP1 - TPX) as needed for heat transfer
qfn packages (or othes small pitch packages) :
use smd pads with roundness 100% (round edges are better for solder paste release)
Additional Information regarding PCB-Design.
This is a work in progress and will hopefully be updated.
