PCB-Design: Eagle Library: Unterschied zwischen den Versionen
Aus Hackerspace Ffm
DCEM (Diskussion | Beiträge) |
DCEM (Diskussion | Beiträge) |
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by: [[Benutzer:DCEM|DCEM]] | by: [[Benutzer:DCEM|DCEM]] | ||
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+ | Polygon: | ||
+ | use Rank to draw polygons into each ohter | ||
Thermal Pads: | Thermal Pads: |
Version vom 3. Januar 2018, 23:53 Uhr
by: DCEM
Polygon: use Rank to draw polygons into each ohter
Thermal Pads: Use thermal symbol connected to GND request level swap use one SMD Pad (TP0) for the surface area use as much Pads (TP1 - TPX) as needed for heat transfer
qfn packages (or othes small pitch packages) : use smd pads with roundness 100% (round edges are better for solder paste release)
Additional Information regarding PCB-Design.
This is a work in progress and will hopefully be updated.
by: DCEM
Description:
<h1>PART_NAME</h1> SHORT_DESCRIPTION <h2>Links</h2> <ul> <li> <a href="HTTPS_LINK">Datasheet</a><br> </li> <li> <a href="HTTPS_LINK">Product website</a><br> </li> </ul>
Keepout
OC_MOUSER
Silk Screen
PCB-Pool: (t/b)Place and (t/b)Names will be printed
minimum font size: 0,6mm (acceptable readability) - 0,8mm (good readability)